SAW grade LT wafer
Typical Specifications
|
Cutting Angle |
Deg. |
X/Y/Z/Y36/Y42/Y48/X112 etc |
|
|
Diameter/size |
mm |
3 "/76.2 |
4 "/100 |
|
Tol(±) |
mm |
0.25 |
0.5 |
|
Thickness |
mm |
0.10mm or more |
0.18mm or more |
|
Primary reference flat |
mm |
22mm or customized |
32.5mm or customized |
|
LTV (5mmx5mm) |
µm |
< 2 |
< 2 |
|
TTV |
µm |
< 8 |
< 10 |
|
Bow |
µm |
± 20 |
± 25 |
|
Warp |
µm |
≤ 30 |
≤ 40 |
|
PLTV |
% |
≥ 95%(5mm * 5mm) |
≥ 95%(5mm * 5mm) |
|
Orientation Flat |
All available |
||
|
Surface Type |
Single Side Polished /Double Sides Polished |
||
|
Polished side Ra |
nm |
≤ 1 |
|
|
Back Side Criteria |
µm |
General is 0.2-0.5 or as customized |
|
|
Edge Rounding |
mm |
Compliant with SEMI M1.2 Standard/refer to IEC62276 |
|
2. These next generation substrates are necessary for handling high volume graphics applications for wireless communications such as "Bluetooth ".
Saw grade Lithium tantalate, LiTaO3 crystal wafer
|
Crystal symmetry |
Trigonal, 3m |
|
Lattice constant, A |
a = 5.154 c = 13.783 |
|
Density, g/cm3 |
7.45 |
|
Melting point , °C |
1650 |
|
Curie point , °C |
605 |
|
Mohs hardness |
6 |
|
Thermal expansion coefficient, 10-6/ °C |
aa = 16 ac = 4 |
|
Thermal conductivity , mW/cm °C |
46 |
|
Dielectric Constant (@ 100 KHz) |
ea = 54 ec = 43 |
|
Refractive indices @ 633 nm |
no = 2.175 ne = 2.180 |
|
Pyroelectric Coefficient: |
-2.3 10-4 C/°C/m2 |
The possible applications
